NEXT/13TH/12TH GEN CORE, HIGH PERFORMANCE - The B760M PROJECT ZERO employs a 12 Phase Duet Rail Power System (75A, DrMOS) VRM for the Intel B760 chipset (LGA 1700, 12th & 13th Gen Core) with Core Boost for high CPU core count power demands INTEGRATED COOLING - VRM cooling features 7W/mK MOSFET thermal pads and an extended heatsink with heat-pipe; Includes chipset heatsink, M.2 Shield Frozr, a dedicated pump-fan cooling header & 6-layer server grade PCB with 2 oz. thickened copper DDR5 MEMORY, PCIe 5.0 x16 SLOTS - 4 x DDR5 DIMM SMT slots enable extreme memory overclocking speeds (1DPC 1R, 7800+ MHz); A PCIe 5.0 x16 Steel Armor slot supports the primary graphics card DOUBLE M.2 CONNECTORS - Storage options include 2 x M.2 Gen4 x4 64Gbps slots with Shield Frozr to prevent SSD thermal throttling; Features a tool-free installation system with EZ M.2 Clips WI-FI 6E CONNECTIVITY - Network hardware includes an Intel Wi-Fi 6E module with Bluetooth 5.3 & 2.5Gbps LAN; Rear ports include USB 3.2 Gen 2x2 Type-C (20Gbps), HDMI 2.1, DP 1.4, and 7.1 HD Audio with Audio Boost (supports S/PDIF output)
B760M PROJECT ZERO features the back-connect design, which allows for a cleaner front view and easier cable management, showcasing the beauty of simplicity.
The B760M PROJECT ZERO moves the power connectors, fan connectors, and other pin headers to the back of the motherboard. This provides a cleaner and neater front view, allowing the motherboard, liquid cooler, and graphics card's aesthetic design to be fully displayed.
Back-Connect Design: Moving the connectors to the back not only keeps the front clean but also makes connector access easier and more effortless.
Easy cable management: Eliminate the step of routing the cables from front to back to lower the difficulty of cable management.
The B760M PROJECT ZERO motherboard supports 12th & 13th Gen Intel Core, Pentium Gold, and Celeron processors.
Form Factor: Back-connect Micro-ATX*
Socket Type: LGA1700
Chipset: Intel B760
* Requires a compatible case.
With its dual 8 pin power connectors and exclusive Core Boost technology, the B760M PROJECT ZERO is able to sustain heavy CPU power loads to support system-demanding game settings:
1. Digital PWM IC
2. 12-Phase Duet Rail Power System (75A DrMOS)
3. 1-Phase GT Power
4. 1-Phase AUX Power
VRM Cooling: Features an extended heatsink, 7W/mK thermal pads and additional choke thermal pads for improved thermal dissipation.
PCB Cooling: Premium 6-layer printed circuit design with 2 oz. thickened copper improves heat dissipation & reliability.
SSD Cooling: M.2 Shield Frozr prevents thermal throttling.
Memory Boost: A fully-isolated DDR circuit delivers pure data signals for optimal gaming and overclocking performance.
XMP profiles in MSI BIOS are MSI OC LAB optimized and can be easily enabled with auto power settings for optimized memory speed and stability.
* 1DPC 1R Max. overclocking frequency 7800+ MHz, supports Intel XMP.
MSI PCI Express Steel Armor slot are secured to the motherboard with extra solder points to support the weight of heavy graphics cards. When every advantage in games counts, Steel Armor also shields the point of contact from electromagnetic interference.
1 x PCI-e 5.0/4.0/3.0 x16 slot* (with Steel Armor**)
1 x PCI-e 4.0/3.0 x16 slot*
1 x PCI-e 3.0 x1 slot
* Supports x16/x4
** MSI Surface Mount Technology (SMT) solder welding improves signal clarity.
The B760M PROJECT ZERO motherboard features MSI's Gen4 M.2 slots:
2 x Gen4 x4 64Gbps slots (with M.2 Shield Frozr)
Even the world’s fastest SSDs will automatically slow if thermal throttling firmware detects excessively high temperatures.
M.2 Shield Frozr is MSI's most advanced thermal solution, offering the best possible protection to ensure maximum SSD transfer speed performance.
2.5G LAN: A Realtek 2.5Gbps LAN controller delivers a premium network gaming experience.
Wi-Fi 6E: Features the latest Intel Wi-Fi 6E module (ultra-low latency, high-bandwidth) & Bluetooth 5.3 technology.
USB 3.2 Gen 2x2 Type-C: Connect to devices and transfer files at high bandwidth rates: 20Gb/s.
HD Audio: 7.1-Channel High Definition Audio with Audio Boost\
Chipset | INTEL B760 |
CPU | Support Intel® Core™ 14th/ 13th/ 12th Gen Processors, Intel® Pentium® Gold and Celeron® Processors LGA1700 |
Memory | 4x DDR5, Maximum Memory Capacity 256GB Memory Support 7800+(OC)/ 7600(OC)/ 7400(OC)/ 7200(OC)/ 7000(OC)/ 6800(OC)/ 6600(OC)/ 6400(OC)/ 6200(OC)/ 6000(OC)/ 5800(OC)/ 5600(JEDEC)/ 5400(JEDEC)/ 5200(JEDEC)/ 5000(JEDEC)/ 4800(JEDEC) MHz Max. overclocking frequency: • 1DPC 1R Max speed up to 7800+ MHz • 1DPC 2R Max speed up to 6600+ MHz • 2DPC 1R Max speed up to 6400+ MHz • 2DPC 2R Max speed up to 5600+ MHzSupports Dual-Channel mode Supports non-ECC, un-buffered memory Supports Intel® Extreme Memory Profile |
Onboard Graphics | 1x HDMI™ Support HDMITM 2.1 with HDR, maximum resolution of 4K 60Hz* 1x DisplayPort Support DP 1.4, maximum resolution of 4K 60Hz* *Available only on processors featuring integrated graphics. Graphics specifications may vary depending on the CPU installed. |
Slot | 2x PCI-E x16 slot 1x PCI-E x1 slot PCI_E1 Gen PCIe 5.0 supports up to x16 (From CPU) PCI_E2 Gen PCIe 3.0 supports up to x1 (From Chipset) PCI_E3 Gen PCIe 4.0 supports up to x4 (From Chipset) |
Audio | Realtek® ALC897 Codec 7.1-Channel High Performance Audio Supports S/PDIF output |
Storage | 2x M.2 M.2_1 Source (From CPU) supports up to PCIe 4.0 x4 , supports 2280/2260/2242 devices M.2_2 Source (From Chipset) supports up to PCIe 4.0 x4 / SATA mode, supports 2280/2260/2242 devices 4x SATA 6G |
RAID | Supports RAID 0, RAID 1, RAID 5 and RAID 10 for SATA storage devices |
USB | 4x USB 2.0 (Rear) 4x USB 2.0 (Front) 2x USB 5Gbps Type A (Front) 3x USB 10Gbps Type A (Rear) 1x USB 10Gbps Type C (Front) 1x USB 20Gbps Type C (Rear) |
LAN | Realtek® 2.5Gbps LAN |
Internal IO | 1x Power Connector(ATX_PWR) 2x Power Connector(CPU_PWR) 1x CPU Fan 1x Pump Fan 4x System Fan 2x Front Panel (JFP) 1x Chassis Intrusion (JCI) 1x Front Audio (JAUD) 1x Tuning Controller connector(JDASH) 2x Addressable V2 RGB LED connector (JARGB_V2) 2x RGB LED connector(JRGB) 1x TPM pin header(Support TPM 2.0) 4x USB 2.0 ports 2x USB 5Gbps Type A ports 1x USB 10Gbps Type C ports |
WIRELESS LAN & BLUETOOTH | Intel® Wi-Fi 6E The Wireless module is pre-installed in the M.2 (Key-E) slot Supports MU-MIMO TX/RX, 2.4GHz / 5GHz / 6GHz* (160MHz) up to 2.4Gbps Supports 802.11 a/ b/ g/ n/ ac/ axSupports Bluetooth® 5.3, FIPS, FISMA * Wi-Fi 6E 6GHz may depend on every country’s regulations and will be ready in Windows 11. ** Bluetooth 5.3 will be ready in Windows 10 build 21H1 and Windows 11. |
LED FEATURE | 4x EZ Debug LED |
BACK PANEL PORTS | ![]()
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OPERATING SYSTEM | Support for Windows® 11 64-bit, Windows® 10 64-bit |
BOX CONTENT | ![]() |
PCB Info | mATX 243.84mmx243.84mm |